Hot Chips 2026: d-Matrix stacks AI accelerator directly on custom DRAM for 100 TB/s per card — TSMC 4nm compute die bonded face-to-face at a 36-micron pitch on top of a custom-designed die - Tom's Hardware
10/10At Hot Chips 2026, TSMC will demonstrate a 4nm compute die stacking an AI accelerator directly on custom DRAM, achieving an unprecedented 100 TB/s bandwidth per card by bonding dies face-to-face at a 36-micron pitch. This innovation highlights advancements in semiconductor integration and AI acceleration technology.
