Tech • IA • Crypto
50 articles analyzed by AI / 142 total
GUC has introduced a 12 Gbps HBM4 PHY and Controller built on TSMC's 3nm process, delivering 2.5 times more bandwidth along with improved power and area efficiency for advanced 2.5D/3D integrated circuits as of April 2026.
China's semiconductor industry continues growing despite export restrictions, supported by increased production and government policy backing, signaling strong domestic market resilience as of April 2026.
South Korea's Q1 2026 economic growth surpassed forecasts due to a semiconductor export boom, highlighting the critical role of chip exports in the country's economy.
TSMC announced next-generation A12 and A13 process technologies expected for production in 2029, underscoring its ongoing advancement in semiconductor fabrication.
TSMC revealed it will not deploy ASML’s latest lithography equipment before 2029 due to cost concerns, affecting plans for future high-end chip production as of April 2026.
TSMC unveiled a new roadmap for process and packaging technologies aimed at reducing AI chip power consumption and increasing density, showing major semiconductor fabrication innovations.
Department of Energy scientists successfully controlled quantum bits in a widely used semiconductor material, a breakthrough that could advance quantum computing hardware.
The US Congress is moving forward with the MATCH Act to limit the Department of Commerce’s discretion on chip export controls, targeting DUV lithography machines, potentially impacting global semiconductor manufacturing supply chains.
ISRL USA and AI Infrastructure Partners plan to establish the first semiconductor subfab R&D center in the United States, marking significant investment in domestic semiconductor research and development infrastructure.
Researchers at IISc Bangalore developed a molecular memristor with 14-bit analog resolution and 4.1 TOPS/W energy efficiency, which could enhance neuromorphic computing systems, advancing semiconductor device technology.