Tech • AI • Robotics
50 articles analyzed by AI / 240 total
KAIST researchers developed a method to mitigate a semiconductor-related greenhouse gas 6,000 times more potent than CO₂ using a 'disorder' technique. This advancement, reported on 2026-09-02, aims to reduce environmental impacts associated with semiconductor manufacturing.
Taiwan Semiconductor Manufacturing Company (TSMC) remains a leading force in advanced semiconductor manufacturing as of 2026-09-02. Renowned for cutting-edge process nodes, TSMC continues to solidify its strategic role in the global chip supply chain.
Samsung is advancing High Bandwidth Memory (HBM) technology with 3D-stacked designs to overcome existing memory capacity limits, enhancing performance for high-end applications. This development was highlighted on 2026-09-02.
U.S. has imposed targeted semiconductor tariffs affecting major South Korean chipmakers Samsung and SK Hynix, with significant implications for the global semiconductor supply chain and corporate strategy, dated 2026-09-02.
Korea Zinc announced an expansion of its semiconductor sulfuric acid production capacity to 320,000 tons as of 2026-09-02. This critical raw material expansion supports growing semiconductor wafer fabrication demands.
Broadcom reported a tripling of AI semiconductor revenue but faced a stock price decline on 2026-09-02 due to missed Q4 guidance. The results underscore both the booming AI chip market and market concerns about near-term outlook.
NXP Semiconductors secured a $250 million loan on 2026-09-02 to expand its chip manufacturing facilities, reflecting strong industry growth prospects and investment in semiconductor production capabilities.
Intel introduced EMIB-T, a new chip packaging technology, positioning it as a competitor to TSMC's CoWoS. This advancement in 3D chip interconnects and packaging was reported on 2026-09-02.
Everspin Technologies and Teledyne HiRel Semiconductors formed a partnership to accelerate adoption of MRAM technology in aerospace and defense applications by improving performance and reliability, announced on 2026-09-02.
GlobalFoundries (GF) and RAAAM Memory Technologies jointly developed next-generation GCRAM technology and a test chip on the FDX platform, aiming to advance memory technology innovation as of 2026-09-02.